| |
HIGH PERFORMANCE |
| FAST CURE |
EXTREME HIGH TEMPERATURE PERFORMANCE |
HIGH AND LOW TEMPERATURE PERFORMANCE |
EXTREME LOW TEMPERATURE PERFORMANCE |
SnapSil* RTV230
Series |
RTV200
Series |
TSE3664 |
RTV31 |
RTV60 |
RTV8262 |
RTV88 RTV88HB |
RTV560 |
RTV566 |
RTV567 |
RTV511 |
RTV577 |
| Data Sheets |
Technical
Data Sheet |
Technical
Data Sheet |
Technical
Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical
Data Sheet |
| Features |
Extremely fast room temperature cure and green strength build. May offer high levels of
productivity. Extended room temperature storage.
UL94 HB recognition. |
Fast room temperature cure, high strength
adhesive offering fl exible mix ratios
and tack free times. |
Fast cure, low viscosity adhesive with deep
section cure capability. UL94 V-0 recognition. |
Flowable sealant with variable work times and cure rates
available through catalyst options. Excellent release
capabilities. |
Flowable sealant with variable work times and
cure rates available through catalyst options.
Excellent release capabilities. |
High temperature, flowable sealant.
MIL-PRF-23586F (non-corrosive
to copper). |
Spreadable paste sealant with variable work times
and cure rates available through catalyst options.
Excellent release capabilities. |
Flowable sealant with low and high temperature
performance capability. Variable work times and
cure times available through catalyst options. Excellent
release capabilities. |
Low volatile, low outgassing sealant with low and high
temperature performance capability. Excellent release
capabilities. |
Low volatile, low out gassing sealant.
Excellent release properties. |
Flowable sealant with variable work times and cure
times available through catalyst options. Excellent
release capabilities. |
Paste sealant with variable work times and cure times available
through catalyst options. Excellent release capabilities. |
Typical Applications (include but not
limited to) |
Applications that require greater productivity;
Industrial assembly applications; Appliances;
Automotive components. |
Assembly applications; Automotive components. |
Solar cells/modules; Automotive electronics;
Electronic devices; Home appliances; Moisture
proof sealing of meters; Moisture proof coating
of electronic circuit boards; Potting of
electric and
communication parts. |
Fabrication of rubber parts; Potting and encapsulating
(electric motors and transformers, surge protectors,
industrial fi lters); Release applications such as rubber
rollers; Thermal insulation; Mechanical protection. |
Potting, encapsulating, cushioning and coating. |
Potting of electronic circuit modules,
electrical connectors and coils. |
Fabrication of rubber parts; Potting and
encapsulating electric motors and transformers;
Casting molds for low-melting point metals;
Release applications such as rubber rollers;
Thermal insulation. |
Cast-in-place heat shielding; Thermal insulation; Potting
and encapsulating of electrical assemblies. |
Low outgassing applications; Cast-in-place heat shielding;
Thermal insulation; Potting and encapsulating of
electrical assemblies. |
Applications that require a low out
gassing product. |
Cast-in-place heat shielding; Thermal insulation; Potting
and encapsulating of electrical assemblies. |
Cast-in-place heat shielding; Thermal insulation; Potting and
encapsulating of electrical assemblies. |
| Key Substrate Adhesion |
Offers primerless
adhesion to many metals,
plastics and glass. |
Offers primerless adhesion to many metals,
plastics and glass. |
Aluminum, Stainless Steel, Plastics (Epoxy resin, polyester, phenolic resin), Glass. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
May require a primer for bonding. |
| Cure Chemistry |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
Alkoxy |
| Mix Ratio (base to curing agent by wt %) |
RTV230A/230B, RTV239A/230B:
12:1
RTV233A/230B:
11:1 |
RTV210B & RTV213B:12.5:1 by weight.
RTV224B: 10:1 by weight |
100:7.5 |
100:0.5 |
100:0.5 |
100:5 |
100:0.5 |
100:0.5 |
100:0.1 |
100:0.1 |
100:0.5 |
100:0.5 |
| Standard Catalyst |
RTV230B |
– |
TSE3664B |
DBT |
DBT |
RTV9858 |
RTV88: DBT RTV9950 RTV88HB: |
DBT |
RTV566B |
RTV567B |
DBT |
DBT |
Catalyst Options
Available+ |
None |
RTV210B, RTV213B,
RTV224B |
None |
Yes |
Yes |
None |
RTV88: Yes |
Yes |
None |
None |
Yes |
Yes |
Color
(Final Product) |
RTV233A/230B:
RTV239A/230B:
RTV230A/230B:
White Black |
Gray to Black |
Gray |
Red |
Red |
Red |
Red |
Red |
Red |
Transluscent |
White |
White |
| Viscosity (cps) |
RTV230A/233A/239A:
700,000
RTV230B: 95,000 |
Paste |
3,000 |
25,000 |
40,000 |
47,000 |
880,000 |
30,000 |
42,700 |
3,900 |
16,000 |
700,000 |
| Useful Temperature Range |
-50 to 205°C
(-58 to 400°F); RTV233A/230B:
-50°C to 250°C
(-58°F to 482°F) |
-50 to 205°C
(-58 to 400°F) |
-54 to 205°C
(-65 to 400°F) |
-54 to 260°C (-65 to 500°F) |
-54 to 260°C
(-65 to 500°F) |
-54 to 260°C (-65 to500°F) |
-54 to 260°C
(-65 to 500°F) |
-115 to 260°C (-175 to 500°F) |
-115 to 260°C (-175 to 500°F) |
-115 to205°C
(-175 to 400°F) |
-115 to 205°C
(-175 to 400°F) |
-115 to 205°C
(-175 to 400°F) |
| Specific Gravity |
RTV230A/230B, RTV239A/230B: 1.39 RTV233A/230B: 1.28 |
1.35 |
1.41 |
1.42 |
1.48 |
1.47 |
1.47 |
1.42 |
1.49 |
1.00 |
1.21 |
1.35 |
| Hardness, Shore A Durometer |
36 |
33-36 |
60 |
54 |
57 |
52 |
58 |
55 |
61 |
20 |
42 |
48 |
| Tensile Strength (psi) |
250 |
250 |
435 |
870 |
990 |
580 |
830 |
690 |
800 |
– |
380 |
440 |
| Elongation (%) |
250
|
250 |
70 |
170 |
120 |
150 |
120 |
120 |
120 |
– |
170 |
150 |
| Tear Strength (Die B, lb/in) |
– |
– |
– |
29 |
40 |
43 |
42 |
31 |
– |
– |
21 |
38 |
| Thermal Conductivity (W/mK) |
– |
– |
0.42 |
0.34 |
0.34 |
0.34 |
0.34 |
0.31 |
– |
0.29 |
0.26 |
0.31 |
Coefficient of Thermal
Expansion (Linear CTE, cm/cm °C (in/in °F))
|
– |
– |
– |
20 x 10-ƽ
(11 x 10-5)
|
20 x 10-ƽ (11x10-5) |
20 x 10-5
(11 x 10-5) |
20 x 10-5
(11 x 10-5) |
20 x 10-5
(11 x 10-5) |
– |
<
25 x 10-5
(14 x 10-5) |
22 x 10-5
(12 x 10-5) |
20 x 10-5
(11 x 10-5) |
Dielectric Strength
(75 mils,V/mil) |
410 |
– |
660 |
4.3 |
450 |
470 |
440 |
540 |
– |
515 |
520 |
470 |
Dielectric Constant
(1 kHz) |
375
(60Hz) |
– |
3.1
(60Hz) |
4.4 |
4.0 |
3.9 |
4.3 |
3.9 |
– |
3.3 |
3.6 |
3.9 |
Dissipation Factor
(1 kHZ) |
0.13
(60Hz) |
– |
0.01
(60Hz) |
0.03 |
0.02 |
0.017 |
0.03 |
0.02 |
– |
0.006 |
0.005 |
0.02 |
Volume Resistivity
(ohm-cm) |
9.13 x 1013
μ-cm |
– |
5 x 1015 |
1.6 x 1014 |
4.4 x 1014 |
4.4 x 1014 |
2.8 x 1014 |
2 x 1014 |
– |
1.1 x 1015 |
2 x 1014 |
5.6 x 1014 |
| Linear Shrinkage (%) |
– |
– |
– |
0.6 |
0.6 |
0.6 |
0.6 |
1 |
– |
0.6 |
1.3 |
0.65 |
Processing:
Work (Pot) Life |
5-10 minutes |
10-30 minutes |
10 minutes |
2 hours |
2 hours |
2 hours |
0.75 hours |
2.25 hours |
1.5 hours |
9 hours |
1.5 hours |
2 hours |
Cure Time @
25°C (77°F)
++
|
30 minutes(1) |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
24 hours |
