Structural Adhesive Films - 350°F Cure
3M™Scotch-Weld™ Structual Adhesive Film AF 191
• Epoxy designed for bonding composites, metal to metal and metal to honeycomb components.
• High shear components.
• Excellent elevated temperature performance.
• Extremely high peel strength.
• Excellent long term durability.
• Flexible cure cycles; from 275°F (135°C) up to 400°F (204°C). |
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3M™ Scotch-Weld™ Structual Adhesive Film AF 555
• Structual adhesive film with long-term durability on honeycomb and metal to metal components.
• Excellent pre-bond humidity performance on composite substrates.
• Minimum of 90 days out-time at ambient conditions.
• Unsupported version available for reticulation.
• Film adhesive can be cured from 300°F (150°C) up to 355°F (180°C). |
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3M™ Scotch-Weld™ Structual Adhesive Film AF 3109-2
• Excellent performance in metal-to-metal and honeycomb sandwich applications in a -67°F to 300°F (-55 to 149°C) temperature range.
• Cure temperature as low as 225°F (107°C) and up to 350°F (177°C).
• Improved resistance to high moisture pre-cure conditions.
• Unsupported version can be reticulated on honeycomb. |
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