CONDUCTIVE ADHESIVES / CHOMERICS - CHO BOND |
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| CHO-BOND®
Conductive Adhesives |
 CHO-BOND
adhesives are electrically conductive epoxy and silicone
resins. Curing mechanisms are either room temperature,
elevated temperature or moisture. Both single and two-component
systems are available, depending on the resin system
selected.
Rigid
Epoxy Adhesives
CHO-BOND
epoxies are two-part, silver-filled or silver-plated-copper-filled
adhesives which cure at room or elevated temperatures
into rigid structural bonds. They're used for bonding
EMI vents, windows, ormesh
gaskets, to shield permanent seams and for filling cracks
and gaps.
CHO-BOND
360 compounds have large (>50 micron), silver-plated-copper
particles, and are designed to bond poorly toleranced
surfaces. The gritty filler bites through thin non-conductive
surfaces such as oxide layers and MIL-C-5541 Class 3
irridite. Because its filler is a blend of pure silver
and silver-plated-copper particles, CHO-BOND 360-208
adhesive offers superior shielding performance without
requiring contact pressure, making this material an
ideal fillet seal. Applications include bonding
and shielding of cast aluminum housings, conduit bulkhead
pass-throughs, filters, and fabricated metal cabinets.
CHO-BOND
500 series compounds are pure silver-filled materials
used where tight tolerances require thin bond lines.
Various cure cycles are available, and the materials
are formulated for easy application by caulking gun,
spatula, needle-spotting, or silkscreening. Their use
for mesh gasket bonding, PC board repair, chip bonding,
rear window defogger repair and as low-temperature-activated
flexible solders demonstrates their versatility.
|
| Specifications
and Product Characteristics (Contact
Chomerics for complete specifications and test procedures) |
CHO-BOND Adhesive |
360-20 |
360-208 |
584-29 |
584-208 |
592 |
1029 |
1030 |
1075*** |
1085 |
1086 |
| Binder |
epoxy |
epoxy |
epoxy |
epoxy |
epoxy |
silicone |
silicone |
silicone |
primer
for 1029 |
primer
for 1030 |
| Filler |
Ag/Cu |
Ag,
Ag/Cu |
Ag |
Ag |
Ag |
Ag/Cu |
Ag/CU |
Ag/Al |
| Mix
Ratio (by wgt.) |
1:1 |
100:33 |
100:6.3 |
1:1 |
100:50 |
1.0:2.5 |
1-part |
1-part |
1-part |
1-part |
| Consistency |
Medium
paste |
thick
paste |
thin
paste |
medium
paste |
nearly
liquid |
thick
paste |
gritty
paste |
medium
paste |
thin
fluid |
thin fluid |
| Specific
Gravity |
5.0±
0.30 |
4.0±
0.40 |
2.5±
0.20 |
2.7±
0.20 |
2.6
±0.25 |
3.0
±0.35 |
3.75
±0.25 |
2.0±
0.25 |
0.87±
0.15 |
0.78±
0.10 |
| Minimum
Lap Shear Strength, psi (MPa) |
1600
(11.04) |
1400
(9.66) |
1200
(8.28) |
700
(4.83) |
1500
(10.35) |
450
(3.11) |
200
(1.38) |
100
(0.69) |
N/A |
N/A |
| Maximum
DC Volume Resistivity, ohm-cm |
0.005 |
0.01 |
0.002 |
0.005 |
0.05 |
0.06* |
0.05 |
0.001 |
N/A |
N/A |
| Use
Temperature |
-80
to 212°F(-62 to 100° C) |
-80
to 212°F(-62 to 100° C) |
-67
to 257°F(-55 to 125° C) |
-80
to 210°F(-62 to 99° C) |
-80
to 210°F(-62 to 99° C) |
-67
to 257°F(-55 to 125° C) |
-67
to 392°F(-55 to 200° C) |
-67
to 392°F(-55 to 200° C) |
-112
to 392°F(-80 to 200° C) |
-112
to 392°F(-80 to 200° C) |
| Elevated
Temperature Cure Cycle |
2.0
hrs. @ 150°F (66°C) |
0.75
hrs. @ 212°F (100°C) |
0.25
hrs. @ 235°F (113°C) |
0.75
hrs. @ 212°F (100°C) |
0.5
hrs. @ 212°F (100°C) |
0.5
hrs. @ 250°F (121°C) |
N/A |
N/A |
N/A |
N/A |
| Room
Temperature Cure Time |
24
hrs. |
24
hrs. |
24
hrs. |
24
hrs. |
1
wk. |
1
wk.** |
1
wk.** |
1
wk.** |
0.5
hr. |
0.5
hr. |
| Working
Life |
1.0
hr. |
1.0
hr. |
0.5
hr. |
1.0
hr. |
4.0
hr. |
2.0
hr. |
0.5
hr. |
0.25
hr. |
N/A |
N/A |
| Shelf
Life, mos. |
9 |
9 |
9 |
9 |
9 |
6 |
6 |
6 |
6 |
6 |
| Coverage,
in2/lb. (cm2/g) |
500(7.1) |
700
(9.9) |
11,000
(156.1) |
10,000
(141.9) |
12,000
(170.3) |
1,800
(25.5) |
1,300
(18.5) |
1,200
(170) |
N/A |
N/A |
| Recommended
Thickness, in. (cm) |
0.010
min. (0.03) |
0.010
min. (0.03) |
0.001
min. (0.003) |
0.001
min. (0.003) |
0.001
min. (0.003) |
.008
max. (0.020) |
0.010max.
(0.03) |
0.010
min (0.03) |
.0002
max (0.001) |
.0002
max (0.001) |
* Value
represents DC resistance in ohms through a 0.4 in2by
0.008 in. (2.58 cm2 by 0.02 cm) thick sample.
** Cure is sufficient for handling in 24 hours. Full specification
properties are developed after 1 week (168 hours.)
*** Values shown for 1075 reflect typical properties.
|
| PRODUCT
NOTES |
360-20
|
Large
particle size allows for thick bond-lines and oxide layer bite-thru. |
1029
|
Two-component
compound used with primer. Bond line <8 mils. (Conductivity
decreases sharply>20 mils.) Long pot life. Cured under
pressure (6 psi/0.04 MPa). For quick bonding of conductive
elastomers.
|
360-208
|
Same as 360-20; no contact pressure required. |
1030 |
One-component. Cures at room temperature and moderate humidity.
Highly conductive. No corrosive curing agents. 30-minute
set. Bond line must be<10 mils. High peel strength. |
584-29
|
Excellent conductivity, easy application. Best general-purpose
system. Available in pre-measured, ready-to-mix CHO-PAKs. |
1075 |
For bonding Ag/Al conductive elastomers.
|
584-208
|
Ease of application for circuit board repair. |
1085 |
Wipe on surface and let air dry 30-60 min. |
| 592 |
Bonds dissimilar materials. |
1086 |
Wipe on surface and let air dry 15-30 min. |
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