PolyStrate™ Epoxy Adhesive Ordering Information... Maintenance, Repair, Production and Tooling Epoxies, Urethanes, Adhesive and Sealants Devcon pioneered epoxy adhesive technology and, today, offers the most technically-advanced selection of PolyStrate™ epoxy adhesives and application systems available. A good example is Devcon's Mark 5™ adhesive system (shown right) which includes an easy-to-load, easy-to-use applicator gun and convenient, 50 ml Dev-Pak™ cartridges (see the complete description in the Methacrylate section). Other innovative application solutions include Devcon's new, safer and easier-to-use Dev-Tube® dispenser 5-Minute® Epoxy A rapid-curing, general-purpose adhesive/encapsulate.   • Bonds rigid, durable substrates such as metals, glass,  ceramics, concrete and wood in all combinations   • Forms a clear, hard, rigid bond or coating in minutes 5-Minute® Epoxy  A fast-curing, thixotropic, non-migrating adhesive, designed for filling gaps and for bonding rough or smooth surfaces.   • High tensile strength (2500 psi)   • Good solvent resistance   • Ideal for vertical surfaces Clear Coat ® Epoxy A high-clarity, non-shrink adhesive/potting compound that provides a strong bond to glass, metals, rigid plastics, concrete and wood.   • Water resistant   • Can be used as a sealing compound  One-Minute™ Epoxy Gel An ultra-fast-curing, thixotropic adhesive gel for immediately filling gaps, cracks and holes.   • Fast cure without fixturing   • Fill gaps   • Non-sagging on vertical surfaces   2-Ton® Clear Epoxy Extremely strong, water-resistant epoxy adhesive.   • Forms a powerful bond with ferrous and non-ferrous metals, ceramics, wood, concrete or glass in any combination   • Medium cure time for a strong, water-resistant, non-shrinking   rigid bond   • Fills poorly mated joining  surfaces, while providing excellent adhesion and good impact strength Epoxy Plus™ 25 and 60 Two rubber-toughened structural adhesives with superior peel, impact, and fatigue resistance. Suitable for bonding a wide range of substrates.   • 25-and-60-minute working time   • Bonds metals, FRP composites, rigid plastics, concrete, glass and wood   • Non-corrosive   • Ideal for potting and encapsulating electronic components HP 250 A high-performance, room-temperature-curing epoxy adhesive with superior toughness and impact resistance for structural bonding applications.   • Ideal for bonding or potting   • Gap-filling thixotropic paste   • Outstanding environmental resistance   • Heat resistant to 250°F                                                                                         Click For Ordering Information...