InvisiSil* LED AND OPTOELECTRONIS ENCAPSULANTS
|
|
Two-part, optically clear, heat curable gels or elastomers. Typical silicone beneļ¬ts include non-yellowing, high light transmittance, and a high refractive index for LED chip encapsulation. Other applications may include, but are not limited to: coating optical devices and semi-conductors; absorbing shock and protecting delicate mechanical components from vibration.
|
|
2 PART ADDITION CURE
|
| IVS4012 |
IVS4312 |
IVS4632 |
IVS5022 |
IVS5332 |
IVSM4500(2) |
| Data SheetsData Sheets
|
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Technical Data Sheet |
Mix Ratio
(base to curing agent by weight) |
1:1 |
1:1 |
1:1 |
1:1 |
1:1 |
1:1 |
Color
(Final Product) |
Transparent |
Transparent |
Transparent |
Transparent |
Transparent |
Transparent |
| Viscosity After Mix @ 23°C (cps) |
800 |
1,000 |
3,200 |
2,200 |
3,300 |
30,000 |
| Useful Temperature Range |
-50 to 205°C
(-58 to 400°F) |
-50 to 205°C
(-58 to 400°F) |
-50 to 205°C
(-58 to 400°F) |
-50 to 205°C
(-58 to 400°F) |
-50 to 205°C
(-58 to 400°F) |
-50 to 205°C
(-58 to 400°F) |
| Refractive Index (nD 25) |
1.40 |
1.41 |
1.41 |
1.51 |
1.53 |
1.41 |
Penetration
(JIS K 6249, mm) |
57 |
– |
– |
34 |
– |
– |
| Hardness, Shore A Durometer |
– |
29 |
64 |
– |
30 |
97 |
| Tensile (MPa) |
– |
0.8 |
9.0 |
– |
0.3 |
4.7 |
| Elongation (%) |
– |
110 |
80 |
– |
50 |
<5 |
| Specific Gravity @ 23°C |
0.98 |
0.99 |
1.05 |
1.06 |
1.12 |
1.10 |
Adhesion Strength
(PPA, MPa) |
– |
0.2 |
2.7 |
– |
0.3 |
– |
| Processing Work (Pot) Life @ 23°C |
4 hours |
6 hours |
8 hours |
8 hours |
8 hours |
24 hours |
| Cure Time 70°C |
30 minutes |
– |
– |
– |
– |
– |
| 150°C |
– |
1 hour |
1 hour |
1 hour |
1 hour |
1 hour(3) |
Note: Additional information may be available on the technical datasheet.
* InvisiSil, SilCool, Lexan, Noryl, and Cycoloy are trademarks of the General Electric Company.
(1) Please see Silicone Material Solutions for LED Packages and Assemblies brochure for more detailed technical information. |
|
