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|
1 PART ADDITION CURE |
| THIN BOND LINE CAPABILITY |
|
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| SilCool* LTR3292 |
SilCool* LTR3295 |
TSE3281-G |
TSE3280-G |
| Data Sheets
Technical Data Sheet |
|
Technical Data Sheet |
Technical Data Sheet |
| Features |
Low thermal resistance, flowable, thermal silicone adhesive. Excellent dielectric properties. Thermal conductivity of 1.8 W/mK. |
Fast cure, low viscosity, thermally conductive adhesive that can offer excellent die shear adhesion4. Thermal conductivity of 1.8 W/mk. |
Flowable, heat curing adhesive offering excellent dielectric properties. Thermal conductivity of 1.7 W/mK. |
Semi-flowable, heat curing adhesive. Thermal conductivity of 0.88 W/mK. |
| Typical Applications (include but not limited to) |
Thermal interface between high performance devices and heat dissipation devices (heat sinks); TIM1/TIM2 applications. |
Electrical and electronic applications where high thermal transfer is required; TIM1/TIM2 applications. |
Thermal interface adhesive for medium performance CPU’s and general heat dissipation in board assemblies. |
Thermal interface adhesive for medium performance CPU’s and general heat dissipation in board assemblies. |
Color
(Final Product) |
Gray |
Gray |
Gray |
Gray |
| Viscosity (cps) |
30,000 |
30,000 |
40,000 |
60,000 |
| Tack Free Time |
– |
– |
– |
– |
| Thermal Conductivity1(W/mK) |
1.8 |
1.8 |
1.68 |
0.88 |
| Thermal Resistance2 (mm2-K/W) |
25
(40 μm) |
37
(50μM) |
35
(50 μm) |
– |
| Useful Temperature Range |
-60 to 205°C
(-75 to 400°F) |
-60 to 205°C
(-75 to 400°F) |
-55 to 200°C
(-67 to 392°F) |
-55 to 200°C
(-67 to 392°F) |
| Specific Gravity |
2.62 |
2.60 |
2.70 |
2.10 |
| Hardness, Shore A Durometer |
83 |
91 |
84 |
62 |
| Tensile Strength (psi) |
375 |
750 |
654 |
470 |
| Elongation (%) |
40 |
39 |
50 |
110 |
| Coefficient of Thermal Expansion (ppm/K) |
– |
1.30 ppm/°C |
1.4 x 10-4 cm/cm °C |
2.2 x 10-4 cm/cm °C |
| Glass Transition Temp |
-120 |
– |
-120 |
– |
Volume Resistivity3
(ohm-cm) |
4.6 x 1015 |
– |
4.8 x 1014 |
2.5 x 1014 |
| Dielectric Strength (kV/mm) |
17 |
– |
15 |
21 |
| Work (Pot) Life @ 23°C |
8 hours |
24 hours |
– |
– |
| Cure Time+ 25°C |
– |
– |
2 hours at 100°C |
2 hours at 100°C |
| 80°C |
– |
30 minutes |
– |
– |
| 120°C |
– |
– |
45 minutes at 125°C |
45 minutes at 125°C |
| 150°C |
1 hour |
10 minutes |
30 minutes |
30 minutes |
