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2 PART ADDITION CURE |
| UL94 V-0 |
GELS |
| TSE3331 |
TSE3080 |
| Data Sheets |
Technical Data Sheet |
Technical Data Sheet |
| Features |
Flowable adhesive with long thermal conductive performance and a long pot life at 23°C. Mix ratio of 1:1. UL94 V-0 recognition. Thermal conductivity of 0.63 W/mK. |
Thermally conductive, flowable, heat curing gel. Mix ratio of 1:1. Thermal conductivity of 0.63 W/mK. |
Typical Applications (include but not limited to)
|
Typical Applications (Include but not limited to)
| Heat-generatingelectronic components; Potting and encapsulating applications; Moisture and vibration protection in power modules, converters, IGBT’s, and other sensitive devices. |
Heat-generating electronic components; Potting and encapsulating applications; Moisture and vibration protection in power modules, converters, IGBT’s, and other sensitive devices. |
Color
(Final Product) |
Dark Gray |
Black |
| Viscosity (cps) |
3,500 |
7,000 |
| Tack Free Time |
– |
– |
| Thermal Conductivity1 (W/mK) |
0.63 |
0.63 |
Thermal Resistance2
(mm2-K/W) |
– |
– |
| Useful Temperature Range |
-55 to 200°C
(-67 to 392°F) |
-50 to 200°C
(-58 to 392°F) |
| Specific Gravity |
1.51 |
1.53 |
| Hardness, Shore A Durometer |
60 |
20
(penetration) |
| Tensile Strength (psi) |
421 |
– |
| Elongation (%) |
70 |
– |
| Coefficient of Thermal Expansion (ppm/K) |
170 |
– |
| Glass Transition Temp |
– |
– |
Volume Resistivity3
(ohm-cm) |
2 x 1014 |
1.0 x 1015 |
| Dielectric Strength (kV/mm) |
26 |
22 |
| Work (Pot) Life @ 23°C |
8 hours |
3 hours |
| Cure Time+ 25°C |
– |
48 hours |
| 80°C |
– |
– |
| 120°C |
1 hour |
100°C for 1 hour |
| 150°C |
– |
– |
Note: Additional information may be available on the technical datasheet. This chart contains typical property values and actual values or results may vary.
- Bulk sample measurement (Hot wire method).
- Laser flash analysis on a Si-Si sandwiched material.
- ASTM E14561 method utilized.
- Testing done on assemblies of silicon die to chromate-coated aluminum panels. 10-psi pressure. 1-2 mil bondline thickness.
Typical adhesion values are 800psi after 30 minutes of cure at 80°C. Dage 4000.
(1)See Thermal Management Silicones for Electronics Brochure for additional technical information.
+ Actual cure time will depend on the cross-sectional thickness of the silicone adhesive, the thermal properties of the overall assembly, and the type and effi ciency of the oven used.
Note: Additional information may be available on the technical datasheet. This chart contains typical p
(1)Cure inhibition may be a concern for addition cure RTVs. Please reference the FAQ page for more information on this phenomenon. |
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