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RTV SILICONES . . . THERMALLY CONDUCTIVE ADHESIVES / 1 PART CONDENSATION CURE . . . 1 PART ADDITION CURE . . . 2 PART ADDITION CURE
THERMALLY CONDUCTIVE ADHESIVES - 1 PART CONDENSATION CURE 1 Part Acetoxy
     
  ONE PART CONDENSATION CURE
FAST TACK FREE TIME    
XE11-B5320   TSE3941
Data Sheets Technical Data Sheet Technical Data Sheet
Features Low volatile, paste adhesive. Thermal conductivity of 1.3 W/mK. Paste adhesive with UL94 V-1 recognition. Thermal conductivity of 0.83 W/mK.
Typical Applications (include but not limited to) Board level assembly and component sealing/repair that requires moderate thermal management performance. Board level assembly and component sealing/repair that requires moderate thermal management performance.
Color
(Final Product)		 White White
Viscosity (cps) – –
Tack Free Time 5 minutes 5 minutes
Thermal Conductivity1 (W/mK) 1.3 0.83
Thermal Resistance2
(mm2-K/W)		 – –
Useful Temperature Range -55 to 200°C
(-67 to 392°F) 		-55 to 200°C
(-67 to 392°F)
Specific Gravity 2.59 1.65
Hardness, Shore A Durometer 80 65
Tensile Strength (psi) 522 421
Elongation (%) 40 100
Coefficient of Thermal Expansion (ppm/K) 190 160
Glass Transition Temp – –
Volume Resistivity3
(ohm-cm) 		2.0 x 1015 4.0 x 1014
Dielectric Strength (kV/mm) 17 22
Work (Pot) Life @ 23°C – –
Cure Time+ 25°C 24 hours 24 hours
80°C – –
150°C – –

Note: Additional information may be available on the technical datasheet. This chart contains typical property values and actual values or results may vary.
  1. Bulk sample measurement (Hot wire method).
  2. Laser flash analysis on a Si-Si sandwiched material.
  3. ASTM E14561 method utilized.
  4. Testing done on assemblies of silicon die to chromate-coated aluminum panels. 10-psi pressure. 1-2 mil bondline thickness.
    Typical adhesion values are 800psi after 30 minutes of cure at 80°C. Dage 4000.

(1)See Thermal Management Silicones for Electronics Brochure for additional technical information.

+ Actual cure time will depend on the cross-sectional thickness of the silicone adhesive, the thermal properties of the overall assembly, and the type and effi ciency of the oven used.

Note: Additional information may be available on the technical datasheet. This chart contains typical p

(1)Cure inhibition may be a concern for addition cure RTVs. Please reference the FAQ page for more information on this phenomenon.


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