Momentive's addition (heat) cure adhesives form a strong bond to most plastic and metal substrates and seal against moisture and environmental contaminants. Flexible cure conditions offer options for cure temperatures and for cure times.
Key Features and Typical Benefits
- One component products - no mixing required
- Fast cure at elevated temperature
- Primerless adhesion to many types of substrates
- No cure by-products, low linear shrinkage
- Non-corrosive to metals and sensitive substrates
- Excellent dielectric properties
- Outstanding performance over a wide thermal range
SilCool Silicone Adhesive - Addition Cure (One Part)
The SilCool series silicone adhesives from Momentive Performance Materials offer 1-Part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They help deliver outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for addressing the heat management challenges arising from the higher frequencies, power, and miniaturization in today’s electronic devices. Designed to efficiently conduct heat, these materials are valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 &TIM2).
Key Features
- Highly workable – excels in automated dispensing, screen printing, and stamping applications
- Fast cure & good adhesion
- High thermal conductivity
- Low thermal resistance
- Wide operating temperature range
- Compatible with high-temperature lead-free processing
- Minimal ionic impurities & excellent dielectric properties
Special Properties of Two Component Silicones
Two component silicones exhibit strong adhesion to glass, plastics, metals, rubbers and other substrates. Specific grades offer:
- Superior flexibility
- Electrical insulation
- Thermal conductivity
- Electrical conductivity
Two-part silicone adhesives provide high performance and cost effective solutions for a wide range of application requirements. Some of the most common include:
- Heat sink attachment
- Board coating
- Potting modules
- Lid and housing seals
- LED assembly
- Bonding and sealing appliances
- Component attachment
Product Literature
The products introduced in this selector guide consist of One Part Heat Cure silicone products that are commonly found in Electric and Electronic applications and component assemblies.
Solutions Guide
Product Literature
Momentive has developed silicone products to withstand a wider range of operating temperatures as compared to epoxies, while still providing the needed protection for sensitive electronic components.
Solutions GuideProduct Literature
The products introduced in this selector guide consist of Two Part Heat Cure silicone products that are commonly found in Electric and Electronic applications and component assemblies.
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