Thermally Conductive Silicone Adhesives for Electronics

Momentive Performance Materials family of SilCool thermally conductive adhesives can help deliver thin bond lines that contribute to low thermal resistance, and provide excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.

Other thermal adhesives from Momentive offer the process convenience of 1-part condensation cure with moderate heat dissipation. Potential applications include board assemblies and sealants in power modules and sensors.

SilCool* Silicone Adhesive - Addition Cure

The SilCool series silicone adhesives from Momentive Performance Materials offer 1-part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They offer outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for applications presented with  heat management challenges that arise from the higher frequencies, power, and miniaturization in today’s electronic devices. Able to efficiently conduct heat, these materials have shown to be valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).
Key Features and Typical Benefits
  • High workability – to help meet the demands of automated dispensing, screen printing, and stamping applications
  • Fast cure & good adhesion
  • High thermal conductivity
  • Low thermal resistance
  • Wide operating temperature range
  • Compatible with high-temperature lead-free processing
  • Minimal ionic impurities & excellent dielectric properties
Product Details
(Charts) Thermal Resistance is proportional to the thickness of the material through which the heat must travel. Increases in pressure during the component assembly process are known to contribute to reductions in thickness of the thermal interface (BLT), and subsequently, reduced thermal resistance.
Silicone Adhesive - Condensation CureMomentive Performance

Materials offers a range of thermally conductive condensation cure adhesives and sealants. These materials cure to form an elastic rubber when exposed to atmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is a unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.

Product Literature

Momentive Solutions
Guide – Electronic

The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies.

Solutions Guide

Product Literature

Momentive Solutions
Guide – Aerospace

From materials used for bonding thermal shields on space shuttles and rockets, to aircraft assembly adhesives and sealants, to vibration-dampening potting materials for vital electronics, our silicone RTVs keep air and spacecraft operating smoothly.

Solutions Guide

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